Motorola AT Commands G24-LC Informações Técnicas

Technical InformationMotorola G30 Developer’s GuideModule Hardware DescriptionDECEMBER 15, 20096802986C55-A

December 15, 2009 G30 - Module Hardware Description vii1-1 Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

U.FL Connector Specifications76 G30 - Module Hardware Description December 15, 2009U.FL Connector SpecificationsThe G30 uses a standard U.FL receptac

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 77Mating ConnectorThe RF mating connector should be a standa

G30 Mounting78 G30 - Module Hardware Description December 15, 2009For more details regarding Hirose mating cable assemblies, refer to http://www.hiro

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 79Layout RecommendationNote: This section applies to G30 LGA

Soldering Re-flow80 G30 - Module Hardware Description December 15, 2009RF RecommendationNote: The restrictions below are valid for both U.FL connecto

December 15, 2009 G30 - Module Hardware Description 81Chapter 5: Service and TestingOrdering InformationG30 different hardware models are given in the

Service82 G30 - Module Hardware Description December 15, 2009• Need documentation?Who to Contact?The Customer Care Group is ready to assist you on in

Chapter 5: Service and Testing December 15, 2009 G30 - Module Hardware Description 83• ATI8I9 // to get the software version of the TXVR• AT+CMER=0

Testing a Standalone Unit84 G30 - Module Hardware Description December 15, 2009Testing a Standalone UnitThis section describes how to perform a G30 f

Chapter 5: Service and Testing December 15, 2009 G30 - Module Hardware Description 856. Open a second terminal window and configure it to operate wit

December 15, 2009 G30 - Module Hardware Description ixPrefaceManual ScopeThis manual provides the electrical, mechanical and environmental requirement

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December 15, 2009 G30 - Module Hrdware Description Acr & Abbr-1Acronyms and Abbreviations Abbreviation Full NameA AMRAdaptive Multi RateA AOCAdv

Acr & Abbr-2 G30 - Module Hrdware Description December 15, 2009E EMCElectromagnetic CompatibilityE EOTDEnhanced Observed Time DifferenceE EPOSEle

Acronyms and Abbreviations December 15, 2009 G30 - Module Hrdware Description Acr & Abbr-3P PDUPacket Data UnitP PLLPhase-locked LoopP PTCRBPCS-1

Acr & Abbr-4 G30 - Module Hrdware Description December 15, 2009U UARTUniversal Asynchronous Receiver TransmitterU USBUniversal Serial BusU USSDUn

December 15, 2009 G30 - Module Hardware Description Index-1IndexAAntenna Installation, xiiApprovalsRegulatory, 6BBlock Diagram Description, 9EEnviron

Index U - U Index-2 G30 - Module Hardware Description December 15, 2009

@6802986C55@6802986C55-AMOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names ar

Regulatory Requirementsx G30 - Module Hardware Description December 15, 2009Regulatory RequirementsThe Federal Communications Commission (FCC) requir

Preface December 15, 2009 G30 - Module Hardware Description xiThis equipment has been tested and found to comply with the limits for a Class B digita

Standardsxii G30 - Module Hardware Description December 15, 2009Antenna Installation• The antenna installation must provide a minimum separation dist

Preface December 15, 2009 G30 - Module Hardware Description xiiiGSM 03.40, Digital cellular telecommunication system (Phase 2+); Technical realizatio

Text Conventionsxiv G30 - Module Hardware Description December 15, 2009WarningWarning: Presents information to warn you of a potentially hazardous si

Preface December 15, 2009 G30 - Module Hardware Description xvField ServiceFor Field Service requests, use this email address:[email protected]

Caring for the Environmentxvi G30 - Module Hardware Description December 15, 2009• not replace components with power cable connected. Under certain c

Preface December 15, 2009 G30 - Module Hardware Description xviiDisposal of Motorola equipment in non-EU countriesIn non-EU countries, dispose of Mot

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICENoticeWhile reasonable efforts have been made to assure the accuracy of this document, Motorola, Inc. a

How to Get Warranty Service?xviii G30 - Module Hardware Description December 15, 2009You must inform Motorola of the lack of conformity to the applic

Preface December 15, 2009 G30 - Module Hardware Description xixIn some cases, you may be requested to provide additional information concerning the m

Installed Dataxx G30 - Module Hardware Description December 15, 20096. Defects or damage due to range, coverage, availability, grade of service, or o

Preface December 15, 2009 G30 - Module Hardware Description xxiRevision HistoryManual Number6802986C55-AManual TitleG30 - Module Hardware Description

Revision Historyxxii G30 - Module Hardware Description December 15, 2009This page intentionally left blank.

December 15, 2009 G30 - Module Hardware Description 1Chapter 1: IntroductionThe G30 is the newest member of Motorola's embedded cellular modules

Product Specifications2 G30 - Module Hardware Description December 15, 2009Product SpecificationsImportant: For safety regulations and requirements,

December 15, 2009 G30 - Module Hardware Description 3EnvironmentalOperational temperature: -30°C to +85°CStorage temperature: -40°C to +85°CPerform

Product Specifications4 G30 - Module Hardware Description December 15, 2009Handset ModeHands Free ModeRinger Mode Supporting Midi filesVocoders EFR/

December 15, 2009 G30 - Module Hardware Description 5GSM Supplementary ServiceCall Hold/Resume (CH)Call Waiting (CW)Multi-Party (MTPY)Call Forwardin

Usage and Disclosure RestrictionsLicense AgreementsThe software described in this document is the property of Motorola, Inc. and its licensors. It is

Regulatory and Approvals6 G30 - Module Hardware Description December 15, 2009Regulatory and Approvals• R&TTE• GCF• FCC/CE • PTCRB • IC• RoHS• Ana

December 15, 2009 G30 - Module Hardware Description 7CFR 47 Part 15.21 Information to userThe user's manual or instruction manual for an intent

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December 15, 2009 G30 - Module Hardware Description 9Chapter 2: Hardware Interface DescriptionThe following paragraphs describe in details the hardwar

Architecture Overview10 G30 - Module Hardware Description December 15, 2009The G30 consists of the following blocks:BasebandThe baseband IC is combin

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 11Operating ModesG30 incorporates several operating mod

Power Supply12 G30 - Module Hardware Description December 15, 2009Power SupplyThe G30 power supply must be a single external DC voltage source of 3.3

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 13Figure 2-2 illustrates the power supply behavior duri

Power Supply14 G30 - Module Hardware Description December 15, 2009Power ConsumptionTable 2-4 specifies typical G30 current consumption ratings in var

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 15Power On/Off OperationThe G30 power on and off proces

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Power On/Off Operation16 G30 - Module Hardware Description December 15, 2009Figure 2-3 illustrates the G30 power on upon application of a power suppl

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 17Turning the G30 Off Using PWR_ONThe PWR_ON signal is

Low Power Mode18 G30 - Module Hardware Description December 15, 2009Low Power ModeThe G30 incorporates an optional low power mode, called Sleep Mode,

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 19The G30 wakes up periodically from low power mode to

Low Power Mode20 G30 - Module Hardware Description December 15, 2009Temporary Termination of Low Power ModeTemporary termination of low power mode oc

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 21Data on the Serial interfaceWhile G30 is temporarily

Real Time Clock22 G30 - Module Hardware Description December 15, 2009Real Time ClockG30 incorporates a Real Time Clock (RTC) mechanism that performs

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 23Serial InterfacesG30 includes three completely indepe

Serial Interfaces24 G30 - Module Hardware Description December 15, 2009When G30 receives a call, the RI signal (Ring Indication), initiates pulse ind

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 25Flashing and Data LoggingIn the event of logging or r

December 15, 2009 G30 - Module Hardware Description iManual Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Serial Interfaces26 G30 - Module Hardware Description December 15, 2009It is recommended to implement the above in accordance with the following tabl

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 27The board to board pins related to I2C bus interface

SIM Interface28 G30 - Module Hardware Description December 15, 2009External SIM CardG30 does not incorporate an on-board SIM card tray for SIM placem

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 29• To avoid crosstalk between the SIM clock and data s

Audio Interface30 G30 - Module Hardware Description December 15, 2009Audio InterfaceThe G30 audio interface supports several audio devices and operat

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 31Figure 2-15 shows the microphone circuit and Table 2-

Audio Interface32 G30 - Module Hardware Description December 15, 2009Figure 2-16 shows the microphone circuit and Table 2-10 gives the microphone spe

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 33Figure 2-17 shows a differential speaker circuit, Fig

Audio Interface34 G30 - Module Hardware Description December 15, 2009Important: When implementing a single ended speaker design, it is required to pl

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 35Important: When implementing a single ended loudspeak

Table of Contentsii G30 - Module Hardware Description December 15, 2009Turning the G30 Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Audio Interface36 G30 - Module Hardware Description December 15, 2009Digital Audio InterfaceThe G30 digital audio interface is a serial Pulse Code Mo

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 37Figure 2-20 illustrates the I2S bus format.Figure 2-2

Audio Interface38 G30 - Module Hardware Description December 15, 2009Table 2-14 describes the available audio paths in Basic mode.Advanced ModeAdvanc

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 39Audio Programming InterfaceThe G30 incorporates a uni

Audio Interface40 G30 - Module Hardware Description December 15, 2009Table 2-16 gives the speech processing features.Gain ControlThe amplification (g

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 41Most of the audio noise originates from the GSM trans

A/D Interface42 G30 - Module Hardware Description December 15, 2009A/D InterfaceThe G30 includes 3 Analog to Digital Converter (ADC) signals with 12-

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 43Important: During GSM transmissions the power supply

Controls and Indicators Interface44 G30 - Module Hardware Description December 15, 2009Controls and Indicators InterfaceThe G30 incorporates several

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 45ResetTo reset the module, RESET_IN must be used (see

Table of ContentsDecember 15, 2009 G30 - Module Hardware Description iiiSupply/power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Controls and Indicators Interface46 G30 - Module Hardware Description December 15, 2009Important: The VREF regulator is powered from the G30's m

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 47In case the serial interface incorporates hardware fl

Controls and Indicators Interface48 G30 - Module Hardware Description December 15, 2009A DC resistance below 100kohm (+10%) is defined as a valid ant

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 49Antenna InterfaceImportant: G30 has two basic hardwar

Antenna Interface50 G30 - Module Hardware Description December 15, 2009Table 2-22 gives the antenna interface specifications.It is the Integrator&apo

December 15, 2009 G30 - Module Hardware Description 51Chapter 3: Electrical and Environmental SpecificationsAbsolute Maximum RatingsTable 3-1 gives th

Operating Parameters52 G30 - Module Hardware Description December 15, 2009Operating ParametersSupply/power PinsDigital PinsTable 3-2: Input Character

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 53I2C interfaceL-level input -0.30 0.82 VI

Operating Parameters54 G30 - Module Hardware Description December 15, 2009Table 3-5: Output CharacteristicsVoltage Domain ParameterLimit ValuesUnit R

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 55SIM interface L-level output0.00 0.20 VV

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Operating Parameters56 G30 - Module Hardware Description December 15, 2009Audio PinsTable 3-6: Pad Pull-up and Pull-down CharacteristicsVoltage Domai

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 57Signal-to-noise ratio75 dBGain stage = +

Operating Parameters58 G30 - Module Hardware Description December 15, 2009Table 3-9: G30 Low Power Single-ended Audio Receive Path CharacteristicsPar

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 59ADC PinsTable 3-10: G30 High Power Diffe

Operating Parameters60 G30 - Module Hardware Description December 15, 2009Input resistance 1 MΩWith respect to AGND.If mode OFF is selected.Input res

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 61Environmental SpecificationsTable 3-12 g

Application Interface Specifications62 G30 - Module Hardware Description December 15, 2009Figure 3-1: G30 - 70 Pin Connector Quick Integration Connec

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 63Figure 3-2: G30 - 81 Pin LGA Interface Q

Application Interface Specifications64 G30 - Module Hardware Description December 15, 2009540GPIO7 I/O GPIOIH100K PUGeneric digital interfaces (Typ.

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 6520 48 VSIM O SIM supply outputVSIM = 1.8

December 15, 2009 G30 - Module Hardware Description v2-1 G30 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Application Interface Specifications66 G30 - Module Hardware Description December 15, 200937 23 RIO Ring Indicator HGeneric digital interfaces (Typ.

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 6748 63,67 SPKR_N OHigh power differen-tia

Application Interface Specifications68 G30 - Module Hardware Description December 15, 200961 64 SPI_MISO ISPI sync data (MISO)Shorted to pin 5547K PU

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 69Note: PU - Pull up, PD - Pull down, I -

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December 15, 2009 G30 - Module Hardware Description 71Chapter 4: Mechanical SpecificationsBoard DimensionsFigure 4-1 and Figure 4-2 describe the G30 m

Board Dimensions72 G30 - Module Hardware Description December 15, 2009Figure 4-2: G30 Mechanical Characteristics - B2B Connector (70 Pin)

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 73LGA Tape & Reel SpecificationFigure 4-3 shows LGA Tape

Interface Connector Specifications74 G30 - Module Hardware Description December 15, 2009Interface Connector SpecificationsThe G30 uses a single 70-pi

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 75Mating ConnectorThe mating connector incorporate the same